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2012mm小体积晶振,TZ2065A,32.768KHZ手表晶振,台湾嘉硕TST晶体特点:
陶瓷接缝封装
卓越的可靠性性能
超微型封装无源晶体
可用于表面安装技术和红外回流工艺
表面安装的2.0mmx1.2mm晶体单元,用于通信装置.
2012mm小体积晶振,TZ2065A,32.768KHZ手表晶振,台湾嘉硕TST晶体 参数表
TZ2065A | Specification |
NominalFrequency | 32.768000KHz |
Storage TemperatureRange | -55°Cto+125°C |
Operating TemperatureRange | -40°Cto+85°C |
Turnover Temperature | 25+/-5°C |
Parabolic CurvatureConstant | -0.027ppm/°C2max. |
FrequencyMakeTolerance(FL) | +/-20 ppm@25°C+/-3°C |
EquivalentSeriesResistor(ESR) | 90KΩmax. |
ShuntCapacitance(Co) | 2.0 pF Max. |
DriveLevel | 0.5uWmax. |
LoadCapacitance(CL) | 12.5pF |
Aging | +/-3.0ppm/year@25°C |
Marking | Lasermarking |
InsulationResistance | 500MΩmin atDC100V |
2012mm小体积晶振,TZ2065A,32.768KHZ手表晶振,台湾嘉硕TST晶体 尺寸图