频率：39.000MHz
尺寸：6.0x3.5mm
Rakon晶体谐振器,QESM04110DT101039.000MHz,物联网6G晶振，新西兰进口晶振，Rakon瑞康晶振，型号：QESM04，编码为：QESM04110DT101039.000MHz，频率为：39.000MHz，小体积晶振尺寸：6.0x3.5mm封装，SMD晶振，石英晶体谐振器，四脚贴片晶振，石英晶振，无铅晶振，SMD石英晶体，工作温度范围：-40℃至+85℃。具有超小型，轻薄型，高精度，高性能，高品质，高质量，耐热及耐环境特点。6035石英贴片晶振被广泛应用于：移动通讯，无线网络，无线局域网，蓝牙模块，物联网，汽车电子，医疗设备，安防设备，平板电脑，数码电子，智能家居，游戏机设备等应用。
Rakon晶体谐振器,QESM04110DT101039.000MHz,物联网6G晶振 参数表
Parameter
Min
Typ
Max
Unit
Test condition / Description
Nominal frequency (Fn)
39
MHz
Calibration tolerance
±10 to
±50
ppm
Frequency at 25°C ± 2°C and
specified load capacitance
Reflow shift
±1
ppm
Frequency shift after reflow with 4
hours settling at 25°C
Operating temperature range
-20 to +70
-40 to +85
°C
Refer to ordering information
Storage temperature range
-40
+85
°C
Frequency stability
over temperature
±10 to
±50
ppm
Referenced to frequency reading at
25°C and the specified load
capacitance
Long-term stability (Aging)
±3
ppm
Frequency drift over 1 year at 25°C
Shunt capacitance (CO)
7.0
pF
Load capacitance (CL)
10
30
pF
Refer to ordering information
Drive level
10
100
µW
Equivalent series resistance (ESR)
10.000 to 10.999MHz
11.000 to 11.999MHz
12.000 to 15.999MHz
16.000 to 39.999MHz
40.000 to 80.000Mhz
100
80
60
40
70
Ω
Mode of vibration:
Fundamental (AT-cut)
Fundamental (AT-cut)
Fundamental (AT-cut)
Fundamental (AT-cut)
3rd Overtone (AT-cut)
Insulation resistance (IR)
500
MΩ
100 V ±15 V at 25°C
Rakon晶体谐振器,QESM04110DT101039.000MHz,物联网6G晶振 尺寸图
Rakon晶体谐振器,QESM04110DT101039.000MHz,物联网6G晶振
6035mm体积的贴片晶振,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的贴片晶振,该产品最适用于无线通讯系统,无线局域网,已实现低相位噪声,低电压,低消费电流和高稳定度,超小型,质量轻等产品特点,产品本身编带包装方式,可对应自动高速贴片机应用,以及高温回流焊接，产品无铅对应，为无铅产品.
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