频率：32.768KHZ
尺寸：2.0x1.2mm
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振,欧美进口晶振,美国FMI晶振,2012mm超小型晶振,无源贴片晶振,32.768K晶振,无源晶振,两脚贴片晶振,尺寸2.0x1.2mm,频率32.768KHZ,负载12.5pF,高稳定晶振,高质量晶振,低功耗晶振,低损耗晶振,数字显示晶振,实时实时晶振,电话机晶振,智能手表晶振,无线设备晶振.
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振特点:
表面贴装陶瓷组件。
Micro 2 x 1.2/超薄
32.768千赫贴片无源晶振
紧密稳定性
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振 参数表
| Parameter | Specification | ||||||||||||||
| Frequency | 32.768 kHz | ||||||||||||||
| Load Capacitance (CL) | 9.0 pF or 12.5 pF | ||||||||||||||
| Frequency Tolerance | ±20 ppm or ±50 @ 25°C | ||||||||||||||
| Turnover Temperature | +25°C ppm ±5°C | ||||||||||||||
| Temperature Coefficient | (-3.5 ±1.0) X 10-8/ºC2 | ||||||||||||||
| Operating Temperature | -40 to +85°C | ||||||||||||||
| Equivalent Series Resistance (ESR) | 90 KΩ max | ||||||||||||||
| Drive Level | 0.1 µWtypical, 0.5 µW max | ||||||||||||||
| Aging @ +25°C | ±5 ppm per year max | ||||||||||||||
| Reflow Conditions | +260ºC ±10ºC for 10 sec max, 2 reflows max | ||||||||||||||
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振 尺寸图
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