频率：32.768KHZ
尺寸：2.0x1.2mm
美国HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ,进口无源晶振,两脚贴片晶振,32.768K晶振,2012小体积晶振,无源晶振,SMD晶振,SMD音叉晶体,尺寸2.0x1.2mm,频率32.768KHZ,负载12.5pF,无铅环保晶振,低损耗晶振,低老化晶振,高品质晶振,高性能晶振,智能体温计晶振,智能手表晶振,电子体重秤晶振,蓝牙耳机晶振,数字水表晶振,微处理器时钟晶振.
美国HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ,进口无源晶振,两脚贴片晶振,32.768K晶振,2012小体积晶振,无源晶振,SMD晶振,SMD音叉晶体,尺寸2.0x1.2mm,频率32.768KHZ,负载12.5pF,无铅环保晶振,低损耗晶振,低老化晶振,高品质晶振,高性能晶振,智能体温计晶振,智能手表晶振,电子体重秤晶振,蓝牙耳机晶振,数字水表晶振,微处理器时钟晶振.
美国HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ特点:
无源晶体具有轻薄小低老化的特点
绝缘电阻：最小500MΩ@直流100V
温度系数：-0.034±0.006ppm/℃²
符合ROHS
美国HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ 参数表
| ELECTRICAL SPECIFICATIONS | ||||||
| PARAMETERS | CONDITIONS | MINIMUM | STANDARD | MAXIMUM | UNIT | |
| FREQUENCY RANGE | 32.768 | KHz | ||||
| FREQ. TOLERANCE | at 25 °C | ±20 | PPM | |||
| DRIVE LEVEL |
10μW typical 100μW Max. |
|||||
| OPERATING TEMPERATURE | -40 °C to +85 °C | °C | ||||
| STORAGE TEMPERATURE | -40 °C to +85 °C | °C | ||||
| SHUNT CAPACITANCE (CO) | 1.5 | pF | ||||
| LOAD CAPACITANCE (CL) | 12.5 pF | pF | ||||
| ESR | 70KΩ Max. | |||||
| AGING CHARACTERISTICS | ±3 PPM / year | |||||
| TEMPERATURE COEFFICIENT -0.034±0.006ppm/℃² | ||||||
美国HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ 尺寸图
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