频率：48.000MHz
尺寸：1.6x1.2mm
可穿戴设备6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振，新西兰进口晶振，Rakon瑞康晶振，型号：QESM10，编码为：QESM10115DT101048.000MHz，频率为：48.000MHz，小体积晶振尺寸：1.6*1.2晶振，四脚贴片晶振，SMD石英晶体，石英晶振，石英晶体谐振器，无铅晶振，贴片石英晶振，工作温度范围：-40℃至+85℃。具有超小型，轻薄型，高精度，高性能，高品质，高质量，耐热及耐环境特点。无源晶振，被广泛应用于：可穿戴设备，小型便捷式设备，通讯设备，无线网络，蓝牙模块，物联网，汽车电子，游戏机设备，医疗设备，安防设备，智能手机，平板电脑，数码电子，智能家居等应用。
可穿戴设备6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振 参数表
Parameter
Min
Typ
Max
Unit
Test condition / Description
Nominal frequency (Fn)
48
MHz
Calibration tolerance
±10 to ±30
ppm
Frequency at 25°C ± 2°C and
specified load capacitance
Reflow shift
±1
ppm
Frequency shift after reflow with 4
hours settling at 25°C
Operating Temperature Range
-20 to +70
-40 to +85
°C
Refer to ordering information
Storage Temperature Range
-55
+125
°C
Frequency stability
over temperature
±10 to
±30
ppm
Referenced to frequency reading at
25°C and the specified load
capacitance
Long-term stability (Ageing)
±2
ppm
Frequency drift over 1 year at 25°C
g sensitivity
2
ppb/g
Gamma vector of all three axes from
30 Hz to 1500 Hz
Shunt capacitance (CO)
3.0
pF
Load capacitance (CL)
5
32
pF
Refer to ordering information
Drive level
10
100
µW
Equivalent series resistance (ESR)
24.000 to 29.999MHz
30.000 to 54.000MHz
100
80
Ω
Mode of vibration:
Fundamental (AT-cut)
Fundamental (AT-cut)
Insulation resistance (IR)
500
MΩ
100 V ±15 V at 25°C
可穿戴设备6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振 尺寸图
可穿戴设备6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振
1612mm体积的晶振,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的石英晶振,该产品最适用于无线通讯系统,无线局域网,已实现低相位噪声,低电压,低消费电流和高稳定度,超小型,质量轻等产品特点,产品本身编带包装方式,可对应自动高速贴片机应用,以及高温回流焊接（产品无铅对应）,为无铅产品.
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