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2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振特点:
表面贴装陶瓷组件。
Micro 2 x 1.2/超薄
32.768千赫贴片无源晶振
紧密稳定性
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振 参数表
Parameter | Specification | ||||||||||||||
Frequency | 32.768 kHz | ||||||||||||||
Load Capacitance (CL) | 9.0 pF or 12.5 pF | ||||||||||||||
Frequency Tolerance | ±20 ppm or ±50 @ 25°C | ||||||||||||||
Turnover Temperature | +25°C ppm ±5°C | ||||||||||||||
Temperature Coefficient | (-3.5 ±1.0) X 10-8/ºC2 | ||||||||||||||
Operating Temperature | -40 to +85°C | ||||||||||||||
Equivalent Series Resistance (ESR) | 90 KΩ max | ||||||||||||||
Drive Level | 0.1 µWtypical, 0.5 µW max | ||||||||||||||
Aging @ +25°C | ±5 ppm per year max | ||||||||||||||
Reflow Conditions | +260ºC ±10ºC for 10 sec max, 2 reflows max |
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶体,FMI音叉晶振 尺寸图