2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振，尺寸2.0x1.2mm，频率32.768KHZ，欧美无源晶体，Bomar小体积晶振，2012mm音叉晶体，32.768KHZ实时时钟晶振，贴片无源晶振，无源晶振，SMD晶振，高质量晶振，高性能晶振，低损耗晶振，低老化晶振，两脚贴片晶振，32.768KHZ无源晶振，移动通信晶振，芯片卡晶振，实时时钟晶振，无线通信设备晶振，具有超高的耐压性能。
BC59系列是一种超小型陶瓷smd无源晶体，高度为0.6毫米。非常适合最小的电路空间可能的应用包括移动通信、芯片卡、实时时钟和无线通信。2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振.
2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振 参数表
| Frequency Range | 32.768 kHz | |||||||||
| Frequency Tolerance @ 25ºC. | ±10ppm, ±20ppm, ±50ppm | |||||||||
| Temperature Coefficient | -0.045ppm / ºC² max. - See Graph Below | |||||||||
| Operating Temperature Range | -40º to +85ºC. | |||||||||
| Load Capacitance | 9.0pF | |||||||||
| Shunt Capacitance | 2pF max. | |||||||||
| Equivalent Series Resistance | 70k ohms max. | |||||||||
| Aging | ±3ppm/ 1styear max. | |||||||||
| Drive Level | 0.1µW max. | |||||||||
| Storage Temperature | -40º to +85ºC. | |||||||||
2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振 尺寸图
2012mm,BC59,BC59CCD119.0-32.768K,Bomar32.768KHZ晶振
产品特性：
尺寸2.0x1.2mm
回流焊接
工作温度为-40º至+85ºC。
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