22M400-8\6G蓝牙模块晶振\进口SMI石英贴片晶体22SMX，尺寸为2.50mmx2.00mm，频率40MHZ，日本进口SMI晶振，超小型晶振，无源SMD晶振，石英贴片晶振，石英晶振，石英晶体谐振器，水晶振动子，无源石英晶振，低损耗贴片晶振，高性能晶振，高品质晶振，6G蓝牙模块专用晶振，6G无线晶振，路由器晶振，仪器设备晶振，便携式设备晶振，物联网专用晶振，可视化智能家居晶振，医疗产品专用晶振，产品具有低损耗高性能的特点，适合用于物联网，蓝牙模块，路由器等领域。
贴片晶振外观使用金属材料封装的,具有高稳定性,高可靠性的石英晶体,晶振外观本身使用金属封装,充分的密封性能,可确保其高可靠性,采用编带包装,外包装采用朔胶盘,可在自动贴片机上对应自动贴装等优势.22M400-8\6G蓝牙模块晶振\进口SMI石英贴片晶体22SMX.
22M400-8\6G蓝牙模块晶振\进口SMI石英贴片晶体22SMX参数表
| Item | Specifications | |||||
| Package type | 22SMX | |||||
| Frequency range | 40.000 MHz | |||||
| Frequency tolerance | ±30 ppm at +25。C ±3。C | |||||
| Temperature stability (referred to +25。C) | ±30 ppm over-20。C to +70。C | |||||
| Load capacitance (CL) | 8 pF, Typical | |||||
| Shunt capacitance (C0) | 5 pF max. | |||||
| Drive level (P) | 100 μW max. (10 μWfor testing) | |||||
| Aging | ±5 ppm max. at +25。C ±3。C per year | |||||
| Cut / Oscillation mode | AT-Cut / Fundamental | |||||
| Reflow condition | 10 seconds max. at +250。C ±10。C | |||||
22M400-8\6G蓝牙模块晶振\进口SMI石英贴片晶体22SMX 尺寸图
SMD晶振特点：
尺寸：2.50mmx2.00mm
频率范围：16~80MHZ
低损耗高性能
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